The 2017 China Label Shenzhen Summit, sponsored by "Haizhonghui UV Ink" and co-organized by Shenzhen Raybang and Yutie Machinery, will be held in Shenzhen International Low-carbon City on July 15. The theme of the summit is "openness, innovation, integration and sharing -- Smart innovation label new future". With "elite BBS + desktop display section electricity + + label" prize-giving grand ceremony of the new pattern, set the red dynamic media resources and the office will experience, ten years together industry experts and brand suppliers, outstanding label printing companies, brand terminal, Internet experts, industry for the future development trend is discussed, and share the achievements of the latest technology and the most valuable business thinking, innovation and change, Create a high-end label elite event with a scale of more than 500 people and move towards a new pattern of business model.

According to the latest news of the organizing committee of 2017 China Label shenzhen Summit, CoolUV signed a contract to become the strategic partner of this summit (speech + display), UV LED curing technology power unit type flexo machine environmental protection, efficient application! CoolUV will display its two series products at booth B09, and Mr. Zhang Donglei, CoolUV Sales Director, will give a speech entitled "The latest Application of UV LED curing technology in machine type flexo machine".

CoolUV Technology Inc. was founded in 2001. Since 2009, CoolUV Technology Inc. has invested in the independent research and development of UVLED. After several years of technological accumulation and product evolution, the products are more mature and stable. CoolUV has mastered the complete core technology and process route, and has completely independent intellectual property rights. Using the world's leading COB packaging technology, cutting-edge micro-channel cooling technology, excellent power supply drive mode, stable power supply scheme, the overall system has reached the world's advanced level. Its production of UV LED light curing equipment brand is "CoolUV", since the official sale, in the inkjet, inkjet, printing, optical communication and other fields has been assembled more than 200 sets of UV LED curing system, in the domestic market installed rate in the front position.

Speech summary

CoolUV Technology Inc. 's curing system has been widely assembled in Nilpeter, Sun Machinery, McAndy, Kidu, OMET, Yidi, Duoweilon, Bangcheng, Youyin and other unit type flexo printing equipment. At present, it is a rare UV LED curing equipment that can truly achieve commercial unit flexo machine. More and more equipment manufacturers and end users attach importance to the technical development and practical application of UVLED, and actively import UVLED into the production line with an open mind, bringing environmental protection and benefits to enterprises. This speech will explain the latest application of UVLED curing technology in unit type flexo machine in detail with the actual case of terminal enterprises.

Product introduction

POWERCURE series, short for P series, is mainly used for medium and low speed curing of offset printing and letterpress printing inks. The P series is notable for its high power output and support for low and medium speed curing. Support speeds of up to 250RPM/min for intermittent offset presses, up to 150m/min for full rotary ticket table machines, and up to 80m/min for satellite letterpress machines. CoolUV Technology Inc. 's curing system has been widely assembled in zhongtian (Zhongtian), Weigang, Wanjie, Qianrun, Sun machinery and other unit type flexo printing equipment. More and more equipment manufacturers and end users attach importance to the technical development and practical application of UVLED, and actively import UVLED into the production line with an open mind, bringing environmental protection and benefits to enterprises.

Product advantages:

Modular design

CoolUV can be easily integrated into any length of curing lamp, and can be designed for a variety of radiation intensity as required, while the basic structure of the product remains unchanged.

Modular standardized design

Take the lead in realizing modular and standardized design solutions worldwide. The control drive board, power supply and UVLED lamp can be exchanged and inserted arbitrarily, with high integration and convenience.

Simulated aging test

Each COOL UV product must undergo thermal, optical and hydrodynamics simulation tests before design, from which to select the optimal scheme to achieve the optical and heat dissipation goals; After each product comes off the line, it must undergo the aging test in the simulated working environment to ensure the stability of product quality.

Digital circuit driver

The self-developed digital drive circuit truly realizes the function of "stepless speed regulation" with 1% regulation, and realizes the linkage with the machine speed, and the power matches perfectly from 0 to 100%.

Vertical chip

CoolUV uses a unique vertical chip with a metal substrate that provides better thermal conductivity, larger luminous area and lower voltage than sapphire substrates, extending product life and enhancing lighting.

Optical design

The core optical design can effectively increase the peak intensity of the spectrum to 120-200% or more of that of the mercury lamp at 365nm. At 380nm or above, the peak intensity can be up to five times that of the mercury lamp at 365nm. At the same time, the light output can effectively form a uniform continuous strip light spot. This is to measure a light source whether high quality, practical key index.

Super heat dissipation scheme

Chip core junction temperature every increase of 10 degrees, the life of the product decreased 10%, the ideal core junction temperature should be controlled in 75 degrees below, and COOL UV through the use of ultra-high thermal conductivity materials, micro channel heat dissipation technology, can be stable control within 60 degrees, measured temperature rise is less than 20 degrees at room temperature. Efficient heat dissipation and temperature control, can greatly improve the light efficiency and chip life, improve product reliability.

COB packaging process

Compared with most of the domestic lamp package array scheme, COOL UV uses the world's leading on-board Chip COB(Chip On Board) process, Chip and substrate directly closely combined, directly heat conduction to the substrate, and then through the water circulation system to achieve high heat dissipation effect. The biggest problem of lamp bead packaging array is that the temperature accumulated in the chip because of multi-layer thermal resistance, can not effectively conduct out, even if the use of air cooling or water cooling, can not effectively take away the heat, so the chip long-term work at high temperature, the product life is greatly reduced.

Excellent reliability of the overall process

Product design, simulation, COB packaging, parts machining, circuit control design and manufacturing, drive design, heat dissipation scheme and manufacturing, optical design, product assembly one-stop mode, master all core technologies. In addition to the production of chips, all other links are 100% controlled to effectively ensure product quality from every link.